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             Item 
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             Standard Capability 
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             Advanced Capability 
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             Remark 
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             Material 
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             Material 
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             Shengyi  FR-4/Kingboard CEM-1/aluminum 
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             / 
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             TG 
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             Shengyi TG140°, 
            kingboard TG>130°  | 
            
              / 
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             Heat Conductivity  for Alu.  boards 
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             1.0 
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             / 
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             CTI 
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             Class 3(CTI≥175V) 
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             / 
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             Specification 
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        ||||||||
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             Surface  finish 
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             HASL, immersion gold, OSP 
             | 
            
             / 
             | 
            
             HASL  is not acceptable for 0.4mm board 
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        |||||
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             Layers 
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             1-6 
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             / 
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              Finished  Board thickness 
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             0.6-2.0mm 
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             0.4mm or 2.4mm 
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             1-2  layers :0.4-2.4MM; 
            4layers :0.8-2.4MM; 6layers :1.2-2.4MM .  | 
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             Thickness  Tolerance 
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             T≥1.0mm 
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             ±10% 
             | 
            
             ±8% 
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             T<1.0mm 
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             ±0.1mm 
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             ±10% 
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             Finished  Copper thickness 
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             1OZ(35um)/2OZ(70um) 
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             / 
             | 
            
             2-6  layers :1oz;2oz; 
            1-layer :1oz  | 
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             finished  inner copper thickness 
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             1OZ(≥1.2mil) 
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             / 
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             Inner  copper thickness 
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        |||||
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             Bow  and twist 
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             Per cater-corner length,≤0.75% 
             | 
            
             / 
             | 
            
             For  boards without SMT, the max. 1.5% 
             | 
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             Drill 
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             PTH deviation 
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             ±3mil 
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             ±2mil 
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             NPTH  deviation 
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             ±2mil 
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             ±1mil 
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             Hole Position Deviation 
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             ±3mil 
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             / 
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             Hole wall roughness(Max.) 
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             1.5mil 
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             1mil 
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             Min.  drilling bit diameter 
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             0.3mm 
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              0.25mm 
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             Max.  drilling bit diameter 
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             6.5mm 
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             / 
             | 
            
             For  vias  larger than 6.5mm,multiple drilling or milling is recommended 
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        |||||
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             Min.  slot width 
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             0.6mm 
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             / 
             | 
            
             For  HASL, the min. finished slot width is 0.45mm,for other surface finish, it is 0.5mm 
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             Board  thickness/via diameter 
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             ≤6:1 
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             ≤7:1 
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             7:1≤value≥6:1,add  one more day for fabrication 
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             PTH deviation 
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             width 
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             ±4mil 
             | 
            
             / 
             | 
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             length 
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             ±5mil 
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             / 
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             NPTH  deviation 
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             width 
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             ±3mil 
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             / 
             | 
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             length 
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             ±4mil 
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             / 
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             Hole  wall copper thickness 
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             Thinnest 
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             ≥0.71mil 
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             ≥1mil 
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             average 
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             ≥0.8mi 
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             ≥1mil 
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             VIA  space (same net) 
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             ≥8mil 
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             ≥6mil 
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             VIA  space (different net) 
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             ≥17mil 
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             ≥14mil 
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             Min.  space for component vias  in different net 
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             ≥24mil 
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             ≥20mil 
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             Max. PTH 
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             Round  hole 
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             8mm 
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             10mm 
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             Slot  holes 
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             6*10mm 
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             8*12mm 
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             Trace 
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             Min. trace width/space 
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             1OZ 
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             6/6mil 
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             5/5mil 
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             The  space refers to the distance between trace to trace, trace to copper 
             | 
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             2OZ 
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             8/8mil 
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             7/7mil 
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             Min.SMD  width 
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             1OZ 
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             ≥10mil 
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             ≥8mil 
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             2OZ 
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             ≥12mil 
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             ≥10mil 
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             Space  between pad to trace 
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             1OZ 
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             8mil 
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             6mil 
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             2OZ 
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             8mil 
             | 
            
             6mil 
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             Min. etching letters 
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             ≥8mil 
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             ≥7mil 
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             Min. space for SMD 
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             ≥10mil 
             | 
            
             / 
             | 
            
             The  data is the min. space to achieve solder mask bridge, if bridge is not  required,pls refer to the min. trace space requirement 
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             V-Cut line to copper 
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              T≥1.5mm,V-cut20° 
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             20mil 
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             16mil 
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            |||||
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             T≤1.2mm,V-cut 20° 
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             16mil 
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             12mil 
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             Trace   width/space deviation 
             | 
            
             ±20% 
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             ±15% 
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             trace  net grids 
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             12/12mil 
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             8/8mil 
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             alignment  accuracy for layer 
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             ±3mil 
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             ±2mil 
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             Space  between trace and border 
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             Inner layer 
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             ≥16mil 
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             ≥12mil 
             | 
            
             If  there is V-cut requirement, pls follow the V-cut standards 
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             Outer layer 
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             ≥10mil 
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             ≥8mil 
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        ||||||
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             space  between via to trace 
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             ≥12mil 
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             ≥10mil 
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             space  between inner via to trace 
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             ≥10mil 
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             ≥8mil 
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             Solder mask 
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             Solder  oil thickness 
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             trace interface 
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             0.4-0.8mil 
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              / 
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             trace corner 
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             ≥0.2mil 
             | 
            
              / 
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             plugged  via diameter 
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             Plugged on both sides 
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             ≤0.45mm 
             | 
            
             0.5-0.55mm 
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             no solder  mask opening on both sides 
             | 
        ||||
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             Plumpness for plugged vias(Max.) 
             | 
            
             100%(孔≤0.4) 
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             50%(孔≤0.45) 
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             refer  to plugged depth 
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             Space  between opening to trace/copper 
             | 
            
             ≥4mil 
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             ≥3mil 
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             opening size(single side) 
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             ≥3mil 
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             ≥2mil 
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             text  width for solder mask opening 
             | 
            
             ≥10mil 
             | 
            
             ≥8mil 
             | 
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             solder  mask bridge width 
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             green、blue≥4mil,white、black≥6mil,others≥5mil 
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             Silkscreen 
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        ||||||||
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             silkscreen  width 
             | 
            
             positive text 
             | 
            
             ≥6mil 
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             5mil 
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             negative text 
             | 
            
             ≥8mil 
             | 
            
             ≥6mil 
             | 
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             silkscreen  height 
             | 
            
             ≥40mil 
             | 
            
             ≥30mil 
             | 
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             space  between silkscreen to copper pad 
             | 
            
             ≥7mil 
             | 
            
             6mil 
             | 
            ||||||
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             the  distance between solder mask oil to copper pad 
             | 
            
             ≥10mil 
             | 
            
             8mil 
             | 
            
             the min. solder mask oil strip is 5mil 
             | 
        |||||
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             space  between silkscreen to border 
             | 
            
             ≥8mil 
             | 
            
             6mil 
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             min.  silkscreen space 
             | 
            
             ≥6mil 
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             5mil 
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             Surface finish 
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        ||||||||
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             OSP 
             | 
            
             Min. dimension 
             | 
            
             50*50mm 
             | 
            
             / 
             | 
            |||||
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             film thickness 
             | 
            
             0.2-0.5um 
             | 
            
             / 
             | 
        ||||||
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             Hot  Air Leveling 
             | 
            
             Tin thickness 
             | 
            
             2.5-30um 
             | 
            
             / 
             | 
            
             the usual tin thickness on pad is no less than 2.5um, for big tin area, it should  be no less than 1um 
             | 
        ||||
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             Immersion  gold 
             | 
            
             Gold thickness 
             | 
            
             1-2U" 
             | 
            
             / 
             | 
            |||||
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             Nickel thickness 
             | 
            
             120-200U" 
             | 
            
             / 
             | 
            ||||||
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             V-CUT 
             | 
        ||||||||
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             Min.  dimension 
             | 
            
             80*80mm 
             | 
            
             / 
             | 
            
             only  for V-cut with one direction, the min. size is 40mm for  the side  without V-cut 
             | 
        |||||
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             Max.  dimension 
             | 
            
             500*500mm 
             | 
            
             Max.  width for manual V-cut board is 500mm, not limited for length 
             | 
        ||||||
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             Min.  board thickness 
             | 
            
             0.6mm 
             | 
            
             / 
             | 
            
             No V-cut for 0.4mm board 
             | 
        |||||
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             V-CUT  angle 
             | 
            
                             20°/30° 
             | 
            
             / 
             | 
            ||||||
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             alignment  accuracy for   neighbouring v-cut 
             | 
            
             ±0.1mm 
             | 
            
             / 
             | 
            ||||||
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             space  for two v-cut lines 
             | 
            
             ≥3mm 
             | 
            
             / 
             | 
            ||||||
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             space  between border to first V-cut line 
             | 
            
             ≥3mm 
             | 
            
             / 
             | 
            ||||||
| 
             remaining  board thickness after V-cut 
             | 
            
             1/3 or 1/4 of board thickness 
             | 
            
             / 
             | 
            
              min.  remaining thickness 0.25mm 
             | 
        |||||
| 
             remaining  board thickness  deviation after V-cut 
             | 
            
             ±0.1mm 
             | 
            
             / 
             | 
            ||||||
| 
             Profiling 
             | 
        ||||||||
| 
             CNC  routing deviation 
             | 
            
             ±0.15mm 
             | 
            
             ±0.10mm 
             | 
            ||||||
| 
             CNC the distance deviation  between via to border 
             | 
            
             ±0.13mm 
             | 
            
             ±0.10mm 
             | 
            ||||||
| 
              min.  slot width 
             | 
            
             0.8mm 
             | 
            
             / 
             | 
            ||||||
| 
             CNC  min.via corner angle for  routing 
             | 
            
             0.4mm 
             | 
            
             / 
             | 
            ||||||
| 
             Min.  PCB dimension 
             | 
            
             5*5mm 
             | 
            
             Min. 3mm for one side 
             | 
            ||||||
Shijiazhuang Linke Electronics Tech Co.,Ltd
Tel: +86-13603214393
Email: [email protected]
Add: Room 1517,Building A,Lecheng Business Plaza,Huai'an west road,Qiaoxi district, Shijiazhuang City,Hebei Province,China.