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Standard PCB Manufacturing Capability

 

Item
Standard Capability
Advanced Capability
Remark
Material
Material
Shengyi  FR-4/Kingboard CEM-1/aluminum
/
 
TG
Shengyi TG140°,
kingboard TG>130°
 /
 
Heat Conductivity  for Alu.  boards
1.0
/
 
CTI
Class 3(CTI≥175V)
/
 
Specification
Surface  finish
HASL, immersion gold, OSP
/
HASL  is not acceptable for 0.4mm board
Layers
1-6
/
 
 Finished  Board thickness
0.6-2.0mm
0.4mm or 2.4mm
1-2  layers :0.4-2.4MM;
4layers  :0.8-2.4MM;
6layers  :1.2-2.4MM .
Thickness  Tolerance
T≥1.0mm
±10%
±8%
 
T<1.0mm
±0.1mm
±10%
 
Finished  Copper thickness
1OZ(35um)/2OZ(70um)
/
2-6  layers :1oz;2oz;
1-layer  :1oz
finished  inner copper thickness
1OZ(≥1.2mil)
/
Inner  copper thickness
Bow  and twist
Per cater-corner length,≤0.75%
/
For  boards without SMT, the max. 1.5%
Drill
PTH deviation
±3mil
±2mil
 
NPTH  deviation
±2mil
±1mil
 
Hole Position Deviation
±3mil
/
 
Hole wall roughness(Max.)
1.5mil
1mil
 
Min.  drilling bit diameter
0.3mm
 0.25mm
 
Max.  drilling bit diameter
6.5mm
/
For  vias  larger than 6.5mm,multiple drilling or milling is recommended
Min.  slot width
0.6mm
/
For  HASL, the min. finished slot width is 0.45mm,for other surface finish, it is 0.5mm
Board  thickness/via diameter
≤6:1
≤7:1
7:1≤value≥6:1,add  one more day for fabrication
PTH deviation
width
±4mil
/
 
length
±5mil
/
NPTH  deviation
width
±3mil
/
 
length
±4mil
/
Hole  wall copper thickness
Thinnest
≥0.71mil
≥1mil
 
average
≥0.8mi
≥1mil
 
VIA  space (same net)
≥8mil
≥6mil
 
VIA  space (different net)
≥17mil
≥14mil
 
Min.  space for component vias  in different net
≥24mil
≥20mil
 
Max. PTH
Round  hole
8mm
10mm
 
Slot  holes
6*10mm
8*12mm
 
Trace
Min. trace width/space
1OZ
6/6mil
5/5mil
The  space refers to the distance between trace to trace, trace to copper
2OZ
8/8mil
7/7mil
Min.SMD  width
1OZ
≥10mil
≥8mil
 
2OZ
≥12mil
≥10mil
Space  between pad to trace
1OZ
8mil
6mil
 
2OZ
8mil
6mil
Min. etching letters
≥8mil
≥7mil
 
Min. space for SMD
≥10mil
/
The  data is the min. space to achieve solder mask bridge, if bridge is not  required,pls refer to the min. trace space requirement
V-Cut line to copper
 T≥1.5mm,V-cut20°
20mil
16mil
 
T≤1.2mm,V-cut 20°
16mil
12mil
 
Trace   width/space deviation
±20%
±15%
 
trace  net grids
12/12mil
8/8mil
 
alignment  accuracy for layer
±3mil
±2mil
 
Space  between trace and border
Inner layer
≥16mil
≥12mil
If  there is V-cut requirement, pls follow the V-cut standards
Outer layer
≥10mil
≥8mil
space  between via to trace
≥12mil
≥10mil
 
space  between inner via to trace
≥10mil
≥8mil
 
Solder mask
Solder  oil thickness
trace interface
0.4-0.8mil
 /
 
trace corner
≥0.2mil
 /
plugged  via diameter
Plugged on both sides
≤0.45mm
0.5-0.55mm
no solder  mask opening on both sides
Plumpness for plugged vias(Max.)
100%(孔≤0.4)
50%(孔≤0.45)
refer  to plugged depth
Space  between opening to trace/copper
≥4mil
≥3mil
 
opening size(single side)
≥3mil
≥2mil
 
text  width for solder mask opening
≥10mil
≥8mil
 
solder  mask bridge width
green、blue≥4mil,white、black≥6mil,others≥5mil
 
Silkscreen
silkscreen  width
positive text
≥6mil
5mil
 
negative text
≥8mil
≥6mil
 
silkscreen  height
≥40mil
≥30mil
 
space  between silkscreen to copper pad
≥7mil
6mil
 
the  distance between solder mask oil to copper pad
≥10mil
8mil
the min. solder mask oil strip is 5mil
space  between silkscreen to border
≥8mil
6mil
 
min.  silkscreen space
≥6mil
5mil
 
Surface finish
OSP
Min. dimension
50*50mm
/
 
film thickness
0.2-0.5um
/
Hot  Air Leveling
Tin thickness
2.5-30um
/
the usual tin thickness on pad is no less than 2.5um, for big tin area, it should  be no less than 1um
Immersion  gold
Gold thickness
1-2U"
/
 
Nickel thickness
120-200U"
/
 
V-CUT
Min.  dimension
80*80mm
/
only  for V-cut with one direction, the min. size is 40mm for  the side  without V-cut
Max.  dimension
500*500mm
 
Max.  width for manual V-cut board is 500mm, not limited for length
Min.  board thickness
0.6mm
/
No V-cut for 0.4mm board
V-CUT  angle
                20°/30°
/
 
alignment  accuracy for   neighbouring v-cut
±0.1mm
/
 
space  for two v-cut lines
≥3mm
/
 
space  between border to first V-cut line
≥3mm
/
 
remaining  board thickness after V-cut
1/3 or 1/4 of board thickness
/
 min.  remaining thickness 0.25mm
remaining  board thickness  deviation after V-cut
±0.1mm
/
 
Profiling
CNC  routing deviation
±0.15mm
±0.10mm
 
CNC the distance deviation  between via to border
±0.13mm
±0.10mm
 
 min.  slot width
0.8mm
/
 
CNC  min.via corner angle for  routing
0.4mm
/
 
Min.  PCB dimension
5*5mm
Min. 3mm for one side
 
 
 
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